GRAFMETAL solution for electroless tin plating of copper is used to coat copper with a thin layer of tin to protect the surface and facilitate soldering. To apply the tin, it is enough to immerse the copper object in the solution, so there is no need for electrolysis. This offer is for a 1000 ml package of the product.
Solution might be used to
Protect the surface of copper from oxidation
Facilitation of soldering
How to use
Before using the product it is necessary to clean the surface of copper. Cleaning may be performed in an example way: clean the surface first with water with a detergent or with alcohol or xylene or with NaOH solution. Rinse the copper object afterwards. Subsequently etch in 10% acetic acid and rinse with water.
Immerse the copper object in the Solution for electroless tin plating for 5-30 min at room temperature.
Remove the object from the Solution and rinse it with water.
If tin plating was not successful, then usually it is necessary to improve surface cleaning stage. Yield: up to 7 m2/L.
Solution may be used for tin plating of Printed Circuit Boards.
First effects can be obtained in a few minutes at room temperature.
Layer of tin deposited with the solution is thin (a fraction of a micrometer), but efficiently fulfills its purpose.
